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Cr\u00e9dit : TSMC<\/figcaption><\/figure>\n

TSMC, le plus grand fondeur de puces au monde, est sur le point de lancer la production de masse de puces de pointe utilisant son n\u0153ud de processus 3 nm. En effet, Digitimes annonce que TSMC devrait commencer la production de masse de puces grav\u00e9es en 3 nm d\u00e8s cette semaine.<\/strong><\/p>\n

Le g\u00e9ant ta\u00efwanais TSMC est un peu en retard dans la f\u00eate, puisque Samsung a commenc\u00e9 la production de semi-conducteurs 3 nm<\/a> il y a environ 6 mois, en juin, et a d\u00e9voil\u00e9 les premi\u00e8res puces 3 nm au monde le 25 juillet.<\/a> De plus, elle a exp\u00e9di\u00e9 le premier lot de puces 3 nm \u00e0 peine un mois plus tard.<\/p>\n