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Des circuits int\u00e9gr\u00e9s sur un wafer en silicium au microscope \/ Cr\u00e9dits : Timo vn via Flickr<\/figcaption><\/figure>\n

Intel vient de d\u00e9voiler sa feuille de route en termes de finesse de gravure pour les 10 prochaines ann\u00e9es. Un plan pr\u00e9visionnel ambitieux m\u00eame si il semble d\u00e9j\u00e0 tr\u00e8s en retrait sur celui de son concurrent TSMC, qui fabrique entre autres les puces AMD. Vous le savez sans doute : Intel est depuis quelques temps chahut\u00e9 par AMD qui propose des processeurs de plus en plus performants pour beaucoup moins cher.<\/p>\n

Le tout gr\u00e2ce entre autres \u00e0 une strat\u00e9gie\u00a0fabless<\/em> (sans unit\u00e9 de fabrication en interne) : AMD se repose sur les unit\u00e9s de production de TSMC qui produit aussi bien les derniers SoC Apple Axx, Qualcomm Snapdragon, que les CPU d'AMD. Le concepteur de CPU peut ainsi se concentrer sur la conception, et profiter de l'avance de TSMC en termes de finesse de gravure, acquise entre autres gr\u00e2ce \u00e0 la sophistication des SoC pour smartphones. De quoi diviser ses couts de R&D tout en b\u00e9n\u00e9ficiant d'une production beaucoup plus flexible que la concurrence.<\/p>\n