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Les puces grav\u00e9es sur un wafer en silicium avant d'\u00eatre d\u00e9coup\u00e9es et mises dans leur casing \/ Cr\u00e9dits : Laura Ockel via Unsplash<\/figcaption><\/figure>\n

TSMC a commenc\u00e9 la production de masse de puces en 5nm ce mois-ci. Et aux derni\u00e8res nouvelles on attend la prochaine \u00e9tape – le 3 nm – pas avant 2022<\/a>. Or on apprend gr\u00e2ce \u00e0 un rapport annuel du fondeur destin\u00e9 \u00e0 ses actionnaires que les travaux autour de la gravure en 2 nm ont en fait d\u00e9j\u00e0 commenc\u00e9 d\u00e8s 2019. Et que les \u00e9tudes pr\u00e9liminaires autour de finesses de gravure encore moindres ont d\u00e9j\u00e0 commenc\u00e9.<\/p>\n

A l'heure actuelle les meilleurs SoC sont grav\u00e9s en 7nm<\/strong>. Les premiers chipsets grav\u00e9s en 5 nm devraient arriver d'ici la fin de l'ann\u00e9e<\/a> – Apple ouvrira vraisemblablement le bal avec un nouveau SoC A14<\/a>. La prochaine \u00e9tape est donc la gravure en 3 nm<\/a>\u00a0dont l'arriv\u00e9e a avanc\u00e9e d'un an sur le calendrier initial, puis la gravure en 2 nm \u00e0 l'horizon 2025<\/strong>, si le fondeur n'est pas entre-temps parvenu \u00e0 acc\u00e9l\u00e9rer son calendrier.<\/p>\n

Compar\u00e9 \u00e0 la gravure en 7 nm, la gravure en 2nm permet de placer 3,5 fois plus de transistors sur la m\u00eame surface. Densifier la quantit\u00e9 de transistors est tr\u00e8s important pour l'industrie mobile. Car cela permet \u00e0 la fois de proposer plus de puissance de calcul dans un espace r\u00e9duit, mais aussi de r\u00e9duire l'impact \u00e9nerg\u00e9tique des puces pour prolonger l'autonomie des smartphones.<\/p>\n

Lire \u00e9galement :\u00a0L'UE a choisi TSMC pour fabriquer un processeur europ\u00e9en -6 nm, RISC-V… voici ce que l'on sait<\/a><\/strong><\/p>\n

Le probl\u00e8me que TSMC doit contourner c'est qu'\u00e0 cette \u00e9chelle les propri\u00e9t\u00e9s physiques des mat\u00e9riaux changent. Au fur et \u00e0 mesure qu'ils se miniaturisent, ces petit die de silicium se complexifient donc \u00e9galement.<\/p>\n

Source : Phonearena<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"TSMC r\u00e9v\u00e8le dans un rapport annuel, que le fondeur se pr\u00e9pare depuis 2019 \u00e0 graver les puces de smartphones en 2 nm. La firme aurait par ailleurs commenc\u00e9 les \u00e9tudes pr\u00e9liminaires pour graver des composants encore plus fins. TSMC a…","protected":false},"author":61,"featured_media":2289079,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[5282],"tags":[],"class_list":["post-2289058","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-processeurs"],"acf":[],"yoast_head":"\nTSMC se pr\u00e9pare d\u00e9j\u00e0 \u00e0 graver des puces de smartphone en 2 nm<\/title>\n<meta name=\"description\" content=\"TSMC r\u00e9v\u00e8le avoir d\u00e9j\u00e0 commenc\u00e9 les travaux autour de la gravure en 2 nm d\u00e8s 2019 et commenc\u00e9 les travaux pr\u00e9paratoires pour aller au-del\u00e0 !\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.phonandroid.com\/tsmc-se-prepare-deja-a-graver-des-puces-de-smartphone-en-2-nm.html\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" 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